Heat Sinks

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BGA-STD-060
BGA-STD-060 - Heat Sink, For Ball Grid Array, Standard, 13.5 °C/W, BGA, 40 mm, 10 mm, 40 mm

2084436

Heat Sink, For Ball Grid Array, Standard, 13.5 °C/W, BGA, 40 mm, 10 mm, 40 mm

ABL HEATSINKS

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1+ CNY14.12 CNY15.96

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13.5°C/W BGA 40mm 10mm
576802B00000G
576802B00000G - Heat Sink, 27.3 °C/W, TO-220, 12.7 mm, 12.7 mm, 19.05 mm

2822611

Heat Sink, 27.3 °C/W, TO-220, 12.7 mm, 12.7 mm, 19.05 mm

BOYD

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1+ CNY13.12 CNY14.83

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27.3°C/W TO-220 12.7mm 12.7mm
FK 244 08 D2 PAK
FK 244 08 D2 PAK - Heat Sink, For D2-Pak, 29.3 °C/W, TO-263, 8 mm, 10 mm, 17.8 mm

4314049

Heat Sink, For D2-Pak, 29.3 °C/W, TO-263, 8 mm, 10 mm, 17.8 mm

FISCHER ELEKTRONIK

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Each

1+ CNY14.55 CNY16.44 125+ CNY14.15 CNY15.99 250+ CNY13.57 CNY15.33 500+ CNY13.19 CNY14.90

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29.3°C/W TO-263 8mm 10mm
577202B00000G
577202B00000G - Heat Sink, Square, PCB, 24.4 °C/W, TO-220, 13.21 mm, 12.7 mm, 19.05 mm

1611441

Heat Sink, Square, PCB, 24.4 °C/W, TO-220, 13.21 mm, 12.7 mm, 19.05 mm

BOYD

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1+ CNY8.15 CNY9.21

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24.4°C/W TO-220 13.21mm 12.7mm
SW25-2G
SW25-2G - Heat Sink, TO-220/218, 13 °C/W, TO-218, TO-220, TO-247, 34.5 mm, 25 mm, 12.5 mm

1213435

Heat Sink, TO-220/218, 13 °C/W, TO-218, TO-220, TO-247, 34.5 mm, 25 mm, 12.5 mm

BOYD

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1+ CNY37.78 CNY42.69

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13°C/W TO-218, TO-220, TO-247 34.5mm 25mm
ICK SMD A 8 SA
ICK SMD A  8  SA - Heat Sink, Black Anodised, 87 °C/W,  For DIP, PLCC, SMD, 4.8mm/6.3mm/8mm

4302175

Heat Sink, Black Anodised, 87 °C/W, For DIP, PLCC, SMD, 4.8mm/6.3mm/8mm

FISCHER ELEKTRONIK

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Each

10+ CNY4.04 CNY4.57 50+ CNY3.96 CNY4.47 100+ CNY3.88 CNY4.38 250+ CNY3.80 CNY4.29

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87°C/W DIP-8, SSOP-20, SSOP-24, SSOP-28, TSSOP-24, TSSOP-28, TSSOP-38 6.3mm 4.8mm
530002B02500G
530002B02500G - Heat Sink, Square, PCB, With Radial Fins, 2.6 °C/W, TO-220, 41.91 mm, 63.5 mm, 25.4 mm

2295719

Heat Sink, Square, PCB, With Radial Fins, 2.6 °C/W, TO-220, 41.91 mm, 63.5 mm, 25.4 mm

BOYD

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1+ CNY42.08 CNY47.55

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2.6°C/W TO-220 41.91mm 63.5mm
4880G
4880G - MOUNTING KIT

1298137

MOUNTING KIT

BOYD

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1+ CNY34.27 CNY38.73

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573300D00010G
573300D00010G - Heat Sink, Square, PCB, For D-Pak Devices, 18 °C/W, TO-263, 12.7 mm, 10.16 mm, 26.16 mm

1611449

Heat Sink, Square, PCB, For D-Pak Devices, 18 °C/W, TO-263, 12.7 mm, 10.16 mm, 26.16 mm

BOYD

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1+ CNY24.12 CNY27.26

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18°C/W TO-263 12.7mm 10.16mm
507302B00000G
507302B00000G - Heat Sink, Square, PCB, 24 °C/W, TO-220, 19.05 mm, 9.67 mm, 19.05 mm

1611415

Heat Sink, Square, PCB, 24 °C/W, TO-220, 19.05 mm, 9.67 mm, 19.05 mm

BOYD

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1+ CNY4.42 CNY4.99

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24°C/W TO-220 19.05mm 9.67mm
ICK S 50 X 50 X 25
ICK S 50 X 50 X 25 - Heat Sink, Square, Pin, For CPU, 2.4 °C/W, Universal Processor, 50 mm, 25 mm, 50 mm

1850059

Heat Sink, Square, Pin, For CPU, 2.4 °C/W, Universal Processor, 50 mm, 25 mm, 50 mm

FISCHER ELEKTRONIK

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1+ CNY109.20 CNY123.40 50+ CNY107.02 CNY120.93 100+ CNY104.84 CNY118.47 250+ CNY102.65 CNY115.99 1250+ CNY100.47 CNY113.53

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2.4°C/W Universal Processor 50mm 25mm
RA-T2X-51E
RA-T2X-51E - Heat Sink, Square, PCB, Black Anodized, 3.5 °C/W, TO-218, TO-220, TO-247, 42 mm, 50.8 mm, 25 mm

2097681

Heat Sink, Square, PCB, Black Anodized, 3.5 °C/W, TO-218, TO-220, TO-247, 42 mm, 50.8 mm, 25 mm

OHMITE

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1+ CNY17.70 CNY20.00 10+ CNY17.62 CNY19.91

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3.5°C/W TO-218, TO-220, TO-247 42mm 50.8mm
529802B02500G
529802B02500G - HEAT SINK

1313891

HEAT SINK

BOYD

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1+ CNY25.63 CNY28.96

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3.7°C/W TO-220 41.9mm 38.1mm
M1802D-PK100
M1802D-PK100 - Transistor Mounting Pad, 3.18 mm L, TO-18 Packages

3831639

Transistor Mounting Pad, 3.18 mm L, TO-18 Packages

MULTICOMP PRO

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Pack of  100

1+ CNY47.79 CNY54.00 10+ CNY41.91 CNY47.36 25+ CNY38.01 CNY42.95 50+ CNY35.22 CNY39.80 100+ CNY32.52 CNY36.75 250+ CNY31.55 CNY35.65 More Pricing...

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TV58G
TV58G - Heat Sink, 30 °C/W, TO-220, 22 mm, 11 mm, 19 mm

170073

Heat Sink, 30 °C/W, TO-220, 22 mm, 11 mm, 19 mm

BOYD

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1+ CNY27.00 CNY30.51

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30°C/W TO-220 22mm 11mm
150CN-02000-A-200
150CN-02000-A-200 - Heat Sink, Extruded Range - 4, Black Anodized, 0.65 °C/W, 200 mm, 25 mm, 200 mm

254204

Heat Sink, Extruded Range - 4, Black Anodized, 0.65 °C/W, 200 mm, 25 mm, 200 mm

H S MARSTON

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1+ CNY233.72 CNY264.10

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0.65°C/W - 200mm 25mm
CMBA024949
CMBA024949 - Heat Sink, For North Bridge, 1.25 °C/W, BGA, 37.5 mm, 33 mm, 37.5 mm

1373245

Heat Sink, For North Bridge, 1.25 °C/W, BGA, 37.5 mm, 33 mm, 37.5 mm

MALICO

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1+ CNY63.15 CNY71.36

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1.25°C/W BGA 37.5mm 33mm
FK 240 SA 220 O
FK 240 SA 220 O - Heat Sink, TO-220, 16 °C/W, TO-220, 14.5 mm, 38.1 mm, 12.7 mm

4621207

Heat Sink, TO-220, 16 °C/W, TO-220, 14.5 mm, 38.1 mm, 12.7 mm

FISCHER ELEKTRONIK

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1+ CNY12.00 CNY13.56 10+ CNY11.63 CNY13.14 25+ CNY11.26 CNY12.72 50+ CNY10.89 CNY12.31 100+ CNY10.52 CNY11.89

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16°C/W TO-220 14.5mm 38.1mm
HF20
HF20 - Heat Sink, TO-220, 13 °C/W, TO-220, 21 mm, 28 mm, 20 mm

1213432

Heat Sink, TO-220, 13 °C/W, TO-220, 21 mm, 28 mm, 20 mm

BOYD

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1+ CNY39.40 CNY44.52

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13°C/W TO-220 21mm 28mm
6099BG
6099BG - Heat Sink, TO-220/202, 11 °C/W, TO-202, TO-220, 34.92 mm, 38.1 mm, 12.8 mm

1213464

Heat Sink, TO-220/202, 11 °C/W, TO-202, TO-220, 34.92 mm, 38.1 mm, 12.8 mm

BOYD

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1+ CNY13.01 CNY14.70 10+ CNY12.75 CNY14.41

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11°C/W TO-202, TO-220 34.92mm 38.1mm
BGA-PP-025
BGA-PP-025 - Heat Sink, For Ball Grid Array, Push-Pin, 9 °C/W, BGA, 49 mm, 15 mm, 49 mm

2084420

Heat Sink, For Ball Grid Array, Push-Pin, 9 °C/W, BGA, 49 mm, 15 mm, 49 mm

ABL HEATSINKS

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Each

1+ CNY30.07 CNY33.98 10+ CNY24.06 CNY27.19 25+ CNY22.53 CNY25.46 50+ CNY21.19 CNY23.94 100+ CNY17.60 CNY19.89

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9°C/W BGA 49mm 15mm
MAX03-HNG
MAX03-HNG - HIGH FORCE RAIL CLIP, 18MM, TO247

2676167

HIGH FORCE RAIL CLIP, 18MM, TO247

BOYD

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1+ CNY2.82 CNY3.19 10+ CNY2.57 CNY2.90 100+ CNY2.51 CNY2.84

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MAX08NG
MAX08NG - HEATSINK CLIP, TO218/TO247/TO247J

2787818

HEATSINK CLIP, TO218/TO247/TO247J

BOYD

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1+ CNY2.10 CNY2.37 10+ CNY1.83 CNY2.07 100+ CNY1.68 CNY1.90 500+ CNY1.59 CNY1.80 1000+ CNY1.44 CNY1.63 5000+ CNY1.38 CNY1.56 10000+ CNY1.31 CNY1.48 25000+ CNY1.29 CNY1.46 More Pricing...

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ICK BGA 31 X 31 X 10
ICK BGA 31 X 31 X 10 - Heat Sink, Square, PCB, For Ball Grid Arrays, 17 °C/W, BGA, 31 mm, 10 mm, 31 mm

1850045

Heat Sink, Square, PCB, For Ball Grid Arrays, 17 °C/W, BGA, 31 mm, 10 mm, 31 mm

FISCHER ELEKTRONIK

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1+ CNY21.56 CNY24.36 50+ CNY21.13 CNY23.88 100+ CNY20.70 CNY23.39 250+ CNY20.27 CNY22.91

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17°C/W BGA 31mm 10mm
647-10-ABEP
647-10-ABEP - Heat Sink, For Board Level Power Semiconductor, 3.8 °C/W, TO-220, 41.9 mm, 25.4 mm, 25.4 mm

1219494

Heat Sink, For Board Level Power Semiconductor, 3.8 °C/W, TO-220, 41.9 mm, 25.4 mm, 25.4 mm

WAKEFIELD THERMAL

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1+ CNY8.45 CNY9.55

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3.8°C/W - 41.9mm 25.4mm