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Quantity | Price (inc GST) |
---|---|
1+ | CNY74.880 (CNY84.6144) |
10+ | CNY69.280 (CNY78.2864) |
25+ | CNY65.860 (CNY74.4218) |
50+ | CNY63.900 (CNY72.207) |
100+ | CNY59.170 (CNY66.8621) |
250+ | CNY56.750 (CNY64.1275) |
Product Information
Product Overview
AS4C512M8D4A-75BIN is a 512M x 8bit DDR4 synchronous DRAM (SDRAM). The DDR4 SDRAM is a high-speed dynamic random-access memory internally organized with sixteen banks (4 bank groups each with 4 banks). The DDR4 SDRAM uses an 8n prefetch architecture to achieve high-speed operation. The 8n prefetch architecture is combined with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write operation for the DDR4 SDRAM consists of a single 8n-bit wide, four-clock data transfer at the internal DRAM core and eight corresponding n-bit wide, one-half clock cycle data transfers at the I/O pins. Read and write operations to the DDR4 SDRAM are burst-oriented, start at a selected location, and continue for a burst length of eight or a ‘chopped’ burst of four in a programmed sequence. Operation begins with the registration of an Activate Command, which is then followed by a Read or Write command.
- JEDEC standard compliant, supports JEDEC clock jitter specification
- Bidirectional differential data strobe, DQS and DQS#, differential clock, CK and CK#
- 16 internal banks: 4 groups of 4 banks each, separated IO gating structures by bank group
- 8n-bit prefetch architecture, precharge and active power down, auto refresh and self refresh
- Low-power auto self refresh (LPASR), self refresh abort, fine granularity refresh
- Dynamic ODT (RTT-PARK and RTT-Nom and RTT-WR), write levelling, DQ training via MPR
- Programmable preamble is supported both of 1tCK and 2tCK mode, command/address (CA) parity
- Read preamble training, control gear down mode, per DRAM addressability (PDA)
- ZQ calibration, command/address latency (CAL), maximum power saving mode (MPSM)
- 78-ball FBGA package, industrial temperature range from -40°C to 95°C
Technical Specifications
DDR4
512M x 8bit
FBGA
1.2V
-40°C
-
No SVHC (27-Jun-2024)
4Gbit
1.333GHz
78Pins
Surface Mount
95°C
MSL 3 - 168 hours
Technical Docs (1)
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
RoHS
RoHS
Product Compliance Certificate