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TC1-10G
HEAT SINK COMPOUND, SYRINGE, 10G
Image is for illustrative purposes only. Please refer to product description.
ManufacturerCHIP QUIK
Manufacturer Part NoTC1-10G
Order Code3549319
Your Part Number
Technical Datasheet
11 In Stock
5 more incoming. You can reserve stock now
11 Delivery in 5-6 Business Days(UK stock)
| Quantity | Price (inc GST) |
|---|---|
| 1+ | CNY111.010 (CNY125.4413) |
Price for:Each
Minimum: 1
Multiple: 1
CNY111.01 (CNY125.44 inc GST)
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
Product Overview
- High density thermal paste
- White, non-curing and non-flowing thermally conductive heat sink compound
- Heavily filled with heat-conductive metal oxide
- Provides high thermal conductivity, low bleed and high temperature stability
- Electrically insulating (2x 1015 ohm-cm)
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:39100000
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.02