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ManufacturerMICRON
Manufacturer Part NoMT53E256M32D2DS-053 WT:B
Order Code3530742
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Technical Datasheet
37 In Stock
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| Quantity | Price (inc GST) |
|---|---|
| 1+ | CNY153.210 (CNY173.1273) |
| 10+ | CNY141.760 (CNY160.1888) |
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CNY153.21 (CNY173.13 inc GST)
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT53E256M32D2DS-053 WT:B
Order Code3530742
Technical Datasheet
DRAM TypeMobile LPDDR4
Memory Density8Gbit
Memory Configuration256M x 32bit
Clock Frequency Max1.866GHz
IC Case / PackageWFBGA
No. of Pins200Pins
Supply Voltage Nom1.1V
IC MountingSurface Mount
Operating Temperature Min-30°C
Operating Temperature Max85°C
Product Range-
SVHCNo SVHC (17-Dec-2015)
Product Overview
MT53E256M32D2DS-053 WT:B is a 8Gb mobile low-power DDR4 SDRAM with low VDDQ (LPDDR4). It is a high-speed CMOS, dynamic random-access memory. The device is internally configured with x16 I/O, 8-banks. Each of the x16’s 536,870,912bit banks is organized as 32,768 rows by 1024 columns by 16bits.
- 1.10V VDD2/0.60V or 1.10V VDDQ operating voltage range, 256 Meg x 32 configuration
- LPDDR4, 2 die count, 535ps, tCK RL = 32/36 cycle time
- 8Gb total density, 3733Mb/s data rate per pin
- 16n prefetch DDR architecture, 8 internal banks per channel for concurrent operation
- Single-data-rate CMD/ADR entry, bidirectional/differential data strobe per byte lane
- Programmable READ and WRITE latencies, programmable and on-the-fly burst lengths
- On-chip temperature sensor to control self refresh rate
- Partial-array self refresh, selectable output drive strength, clock-stop capability
- Directed per-bank refresh for concurrent bank operation and ease of command scheduling
- 200-ball WFBGA package, operating temperature range from -30°C to +85°C
Warnings
Market demand for this product has caused an extension in leadtimes. Delivery dates may fluctuate. Product exempt from discounts.
Technical Specifications
DRAM Type
Mobile LPDDR4
Memory Configuration
256M x 32bit
IC Case / Package
WFBGA
Supply Voltage Nom
1.1V
Operating Temperature Min
-30°C
Product Range
-
Memory Density
8Gbit
Clock Frequency Max
1.866GHz
No. of Pins
200Pins
IC Mounting
Surface Mount
Operating Temperature Max
85°C
SVHC
No SVHC (17-Dec-2015)
Technical Docs (2)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Singapore
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Singapore
Country in which last significant manufacturing process was carried out
Tariff No:85423239
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Dec-2015)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.001519