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2202548
Breadboard, Electronic Housing, Solderless
Image is for illustrative purposes only. Please refer to product description.
ManufacturerPHOENIX CONTACT
Manufacturer Part No2202548
Order Code2484405
Also Known As2202548, ME-IO 18,8/28 TBUS DEV-PCB
Technical Datasheet
Available to Order
Manufacturer Standard Lead Time: 8 week(s)
Notify me when back in stock
| Quantity | Price (inc GST) |
|---|---|
| 1+ | CNY172.130 (CNY194.5069) |
| 5+ | CNY168.690 (CNY190.6197) |
| 10+ | CNY165.250 (CNY186.7325) |
| 20+ | CNY161.810 (CNY182.8453) |
| 50+ | CNY158.360 (CNY178.9468) |
Price for:Each
Minimum: 1
Multiple: 1
CNY172.13 (CNY194.51 inc GST)
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Product Information
ManufacturerPHOENIX CONTACT
Manufacturer Part No2202548
Order Code2484405
Also Known As2202548, ME-IO 18,8/28 TBUS DEV-PCB
Technical Datasheet
Board TypeBreadboard / Solderless
Board Material-
Hole Diameter-
External Height-
External Width-
Board Thickness-
SVHCNo SVHC (21-Jan-2025)
Product Overview
A perfboard for use with a Phoenix Contact ME-IO 18.8 DIN rail mounting development kit.
- Suitable for use with HSCH 2.5 headers
- Ideal for manual soldering
- 2.54mm Pitch
- Made from FR 4-21
Technical Specifications
Board Type
Breadboard / Solderless
Hole Diameter
-
External Width
-
SVHC
No SVHC (21-Jan-2025)
Board Material
-
External Height
-
Board Thickness
-
Technical Docs (2)
Associated Products
1 Product Found
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Germany
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Germany
Country in which last significant manufacturing process was carried out
Tariff No:85340019
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (21-Jan-2025)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.00222