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850 In Stock
600 more incoming. You can reserve stock now
150 Next business day delivery available(Shanghai stock)
700 Delivery in 5-6 Business Days(UK stock)
Quantity | Price (inc GST) |
---|---|
10+ | CNY3.040 (CNY3.4352) |
Price for:Each
Minimum: 10
Multiple: 10
CNY30.40 (CNY34.35 inc GST)
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Product Information
ManufacturerAMP - TE CONNECTIVITY
Manufacturer Part No5050865-5
Order Code2452557
InsulationNon Insulated
Mounting Hole Dia1.83mm
Terminal PlatingGold
Overall Length6.6mm
Length - Below Flange6.24mm
Product Range-
SVHCNo SVHC (21-Jan-2025)
Product Overview
The 5050865-5 is a closed bottom discrete Socket Assembly with beryllium copper miniature spring and tin-plated copper sleeve. It is suitable for use with printed circuit board and 20 to 18AWG wire/cable.
- Through-hole - press-fit termination method to PC board
- Solder termination method to wire/cable
- Hand/semi-automatic insertion method
- 7.5A Contact current rating
- -65 to 125°C Operating temperature range
Applications
Industrial
Technical Specifications
Insulation
Non Insulated
Terminal Plating
Gold
Length - Below Flange
6.24mm
SVHC
No SVHC (21-Jan-2025)
Mounting Hole Dia
1.83mm
Overall Length
6.6mm
Product Range
-
Technical Docs (4)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:85366990
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (21-Jan-2025)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.000059