Y1624500R000T9R

The VSMP series wraparound surface-mount Chip Resistor utilizes ultra high precision Bulk Metal® Z-foil. The Z-foil technology provides a significant reduction of the resistive element's sensitivity to ambient temperature variations (TCR) and to self heating when power is applied (power coefficient). Along with the inherently low PCR and TCR, Z-foil technology also provides remarkably improved load life stability, low noise and availability of tight tolerance. It has a full wraparound termination which ensures safe handling during the manufacturing process, as well as providing stability during multiple thermal cycling.

• Non hot spot design
• Non-inductive, non-capacitive design
• Tolerance to ±0.01%
• Power rating to 750mW @ 70°C
• Load life stability to ±0.005% @ 70°C, 2000hrs at rated power
• <lt/>1s Fast thermal stabilization
• Electrostatic discharge (ESD) up to 25000V
• ≤0.005% Short time overload
• 1ns Effectively no ringing rise time
• -42dB Current noise
• <lt/>0.1ppm/V Voltage coefficient
• <lt/>0.08µH Non inductive