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数量 | 价钱 (含税) |
---|---|
1+ | CNY44.590 (CNY50.3867) |
10+ | CNY41.580 (CNY46.9854) |
25+ | CNY39.660 (CNY44.8158) |
50+ | CNY38.050 (CNY42.9965) |
100+ | CNY36.440 (CNY41.1772) |
250+ | CNY35.590 (CNY40.2167) |
500+ | CNY34.750 (CNY39.2675) |
产品概述
AS4C64M16D3LC-12BIN is a 64M x 16bit DDR3L synchronous DRAM (SDRAM). The 1Gb double-data-rate-3L (DDR3L) DRAMs is a double data rate architecture to achieve high-speed operation. It is internally configured as an eight-bank DRAM. The 1Gb chip is organized as 8Mbit x 16 I/Os x 8 bank devices. It achieves high-speed double-data-rate transfer rates of up to 1600Mb/sec/pin for general applications. The chip is designed to comply with all DDR3L DRAM key features and all of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with differential DQS pairs in a source-synchronous fashion.
- JEDEC standard compliant, supports JEDEC clock jitter specification
- Fully synchronous operation, fast clock rate: 800MHz, differential clock, CK and CK#
- Bidirectional differential data strobe, DQS and DQS#, 8 internal banks for concurrent operation
- 8n-bit prefetch architecture, pipelined internal architecture, precharge and active power down
- Programmable mode and extended mode registers, additive latency (AL): 0, CL-1, CL-2
- Programmable burst lengths: 4, 8, burst type: sequential/interleave, output driver impedance control
- Auto refresh and self refresh, write levelling
- ZQ calibration, dynamic ODT (Rtt-Nom and Rtt-WR)
- 96-ball FBGA package
- Industrial temperature range from -40°C to 95°C
技术规格
DDR3
64M x 16位
FBGA
1.35V
-40°C
-
No SVHC (27-Jun-2024)
1Gbit
800MHz
96引脚
表面安装
95°C
MSL 3 - 168小时
技术文档 (1)
法律与环境
进行最后一道重要生产流程所在的地区原产地:Taiwan
进行最后一道重要生产流程所在的地区
RoHS
RoHS
产品合规证书