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SIL PAD TSP K1100
Silicone Pad, Thermal Conductive, 1.1 W/mK, -60 °C to 180 °C, 12 mm x 17 mm Each Pad
Image is for illustrative purposes only. Please refer to product description.
533 In Stock
500 more incoming. You can reserve stock now
533 Delivery in 5-6 Business Days(UK stock)
| Quantity | Price (inc GST) |
|---|---|
| 1+ | CNY27.270 (CNY30.8151) |
| 5+ | CNY25.280 (CNY28.5664) |
| 10+ | CNY23.460 (CNY26.5098) |
| 20+ | CNY22.410 (CNY25.3233) |
| 50+ | CNY21.540 (CNY24.3402) |
Price for:Pack of 10
Minimum: 1
Multiple: 1
CNY27.27 (CNY30.82 inc GST)
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Product Overview
SIL PAD TSP K1100 is a Sil-Pad K-6 with medium performance, film-based thermally conductive insulator. Thermally conductive polyimide film MT film is coated with an aluminium oxide/boron nitride filled silicone elastomer to deliver "boron nitride" performance. Polyimide film provides a continuous physically tough dielectric barrier against cut-through and resultant assembly failures. Applications include thermal management, thermally conductive adhesive.
- Silicone technology
- Blue-green appearance
- Polyimide film reinforcement carrier
- Operating temperature range -60 to 180°C
Technical Specifications
Thermal Conductivity
1.1W/m.K
Thickness
0.15mm
Dielectric Strength
-
External Width
304.8mm
SVHC
No SVHC (25-Jun-2025)
Conductive Material
Silicone Elastomer
Thermal Impedance
-
External Length
304.8mm
Product Range
-
Technical Docs (3)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:85479000
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:To be advised
SVHC:No SVHC (25-Jun-2025)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.002