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产品概述
The 2506031027Y0 is a multi-layer Chip Bead to suppress conducted EMI signals. Chip beads can be used in an array of devices such as cellular phones, computers, laptops, pagers, etc. The small package sizes accommodate automated placements and allow for a dense packaging of circuit boards. Chip beads are 100% tested for impedance and DC resistance. They are available in standard, high and GHz signal speeds. The multi-layer chip beads are organized by increasing package size and current carrying capacity.
- Chip Beads are Measured for Impedance on HP 4291A and Fixture HP 16192A
- Chip Beads have plated contacts, 100% Tin over Nickel undercoating
- Suggested Land Patterns are in Accordance to the Latest Revision of IPC-7351
- -55°C to 125°C Recommended Storage and Operating Temperature Range
- 0603 Package Size
技术规格
铁氧体磁珠外壳/封装
0603 [1608公制]
额定直流电流
300mA
阻抗公差
± 25%
产品宽度
0.8mm
铁氧体磁芯安装
表面安装
工作温度最高值
125°C
产品范围
-
阻抗
1kohm
直流电阻最大值
0.55ohm
产品长度
1.6mm
产品高度
0.8mm
工作温度最小值
-55°C
合规
-
SVHC(高度关注物质)
No SVHC (21-Jan-2025)
技术文档 (1)
2506031027Y0 的替代之选
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法律与环境
原产地:
进行最后一道重要生产流程所在的地区原产地:Taiwan
进行最后一道重要生产流程所在的地区
进行最后一道重要生产流程所在的地区原产地:Taiwan
进行最后一道重要生产流程所在的地区
税则号:85051190
US ECCN:EAR99
EU ECCN:NLR
RoHS 合规:是
RoHS
RoHS 邻苯二甲酸盐合规:是
RoHS
SVHC:No SVHC (21-Jan-2025)
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重量(千克):.00015