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产品概述
The 2518121217Y3 is a Multilayer Chip Bead suitable for cellular phones, laptops and pagers. The multilayer chip bead to suppress conducted EMI signals. The small package sizes accommodate automated placements and allow for a dense packaging of circuit boards. The chip bead is available in standard, high and GHz signal speeds. The nominal impedance with a ±25% tolerance is specified for the + marked 100MHz. The chip bead is measured for impedance on the HP 4291A and fixture HP 16192A.
- Medium current
- Standard signal speed
- 100% Tested for impedance and DC resistance
- -55 to 125°C Operating temperature range
技术规格
铁氧体磁珠外壳/封装
1812 [4532公制]
额定直流电流
3A
阻抗公差
± 25%
产品宽度
1.6mm
铁氧体磁芯安装
表面安装
工作温度最高值
125°C
产品范围
-
阻抗
120ohm
直流电阻最大值
0.04ohm
产品长度
4.5mm
产品高度
3.2mm
工作温度最小值
-55°C
合规
-
SVHC(高度关注物质)
No SVHC (21-Jan-2025)
技术文档 (1)
法律与环境
原产地:
进行最后一道重要生产流程所在的地区原产地:Taiwan
进行最后一道重要生产流程所在的地区
进行最后一道重要生产流程所在的地区原产地:Taiwan
进行最后一道重要生产流程所在的地区
税则号:85051190
US ECCN:EAR99
EU ECCN:NLR
RoHS 合规:是
RoHS
RoHS 邻苯二甲酸盐合规:是
RoHS
SVHC:No SVHC (21-Jan-2025)
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重量(千克):.000177