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数量 | 价钱 (含税) |
---|---|
1+ | CNY22.110 (CNY24.9843) |
10+ | CNY17.250 (CNY19.4925) |
25+ | CNY17.180 (CNY19.4134) |
50+ | CNY15.800 (CNY17.854) |
100+ | CNY14.420 (CNY16.2946) |
500+ | CNY13.570 (CNY15.3341) |
产品信息
产品概述
CYW20835PB1KML1GGF is an AIROC™ CYW20835 Bluetooth® LE system on chip. It is a Bluetooth® 5.2 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20835 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® Low Energy solutions. The AIROC™ CYW20835 Bluetooth® LE SoC is designed to support the entire spectrum of Bluetooth® Low Energy use cases for home automation, accessory, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, wireless input devices including game controllers, remote controls, keyboards, and joysticks or any Bluetooth® LE connected IoT application.
- 96-MHz Arm® Cortex®-M4 microcontroller unit MCU with floating point unit (FPU)
- Supports serial wire debug (SWD)
- Runs Bluetooth® stack and application
- 384KB RAM, 2MB ROM memory
- 1x I2S, 1x PCM, PDM, analogue front end for analogue microphone
- 24 GPIOs
- 6x 16-bit PWMs, WDT, 1x peripheral UART, 1x UART for programming and HCI, 1x SPI, 1x I2C, 1xADC
- Wide operating voltage range - 1.625V to 3.63V
- 4 power modes to implement ultra-low power application
- 7mm x 7mm 60-pin quad flat no-lead (QFN) package
技术规格
蓝牙 LE 5.2
3.63VDC
2Mbps
-94.5dBm
85°C
No SVHC (21-Jan-2025)
1.62VDC
-
1级
-30°C
AIROC Series
技术文档 (1)
法律与环境
进行最后一道重要生产流程所在的地区原产地:United States
进行最后一道重要生产流程所在的地区
RoHS
RoHS
产品合规证书