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产品信息
制造商MICRON
制造商产品编号MT53E128M32D2FW-046 IT:A
库存编号3652204
技术数据表
DRAM类型Mobile LPDDR4
存储密度4Gbit
记忆配置128M x 32位
时钟频率最大值2.133GHz
IC 外壳 / 封装TFBGA
针脚数200引脚
额定电源电压1.1V
芯片安装表面安装
工作温度最小值-40°C
工作温度最高值95°C
产品范围-
SVHC(高度关注物质)No SVHC (17-Dec-2015)
产品概述
MT53E128M32D2FW-046 IT:A is a mobile LPDDR4 SDRAM. The low-power DDR4 SDRAM (LPDDR4) or low VDDQ (LPDDR4X) is a high-speed CMOS, dynamic random-access memory. The device is internally configured with x16 channel, each channel has8-banks. LPDDR4 uses a double-data-rate (DDR) protocol on the DQ bus to achieve high-speed operation. The DDR interface transfers two data bits to each DQ lane in one clock cycle and is matched to a 16n-prefetch DRAM architecture.
- 16n prefetch DDR architecture, 8 internal banks per channel for concurrent operation
- Single-data-rate CMD/ADR entry, bidirectional/differential data strobe per byte lane
- Programmable READ and WRITE latencies (RL/WL), programmable and on-the-fly burst lengths (BL=16, 32)
- Directed per-bank refresh for concurrent bank operation and ease of command scheduling
- On-chip temperature sensor to control self refresh rate
- Partial-array self refresh (PASR), selectable output drive strength (DS), clock-stop capability
- 2133MHz clock rate, 4266Mb/s/pin data rate
- 4Gb total density, 1.10V VDD2/0.60V or 1.10V VDDQ operating voltage
- 128 Meg x 32 configuration
- 200-ball TFBGA package, -40°C to +95°C operating temperature
技术规格
DRAM类型
Mobile LPDDR4
记忆配置
128M x 32位
IC 外壳 / 封装
TFBGA
额定电源电压
1.1V
工作温度最小值
-40°C
产品范围
-
存储密度
4Gbit
时钟频率最大值
2.133GHz
针脚数
200引脚
芯片安装
表面安装
工作温度最高值
95°C
SVHC(高度关注物质)
No SVHC (17-Dec-2015)
技术文档 (1)
法律与环境
原产地:
进行最后一道重要生产流程所在的地区原产地:Singapore
进行最后一道重要生产流程所在的地区
进行最后一道重要生产流程所在的地区原产地:Singapore
进行最后一道重要生产流程所在的地区
税则号:85423239
US ECCN:EAR99
EU ECCN:NLR
RoHS 合规:是
RoHS
RoHS 邻苯二甲酸盐合规:是
RoHS
SVHC:No SVHC (17-Dec-2015)
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产品合规证书
重量(千克):.002268