507-1422

Multicomp Typ 400 solder wires have been specially formulated to complement No Clean wave and reflow soldering processes. They are also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning. This is designed for users who require a halide free formulation. Multicomp solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish. The good thermal stability of fluxes means they are also well suited to soldering applications requiring high melting temperature alloys.

• Solder wire applicable at repair operations
• Designed for users who require a halide free formulation
• Formulated to complement no clean wave and reflow soldering processes
• Multicomp products are rated 4.6 out of 5 stars
• 12-month limited warranty *view Terms & Conditions for details
• 96% of customers would recommend to a friend

注释

Lead Free. Material Composition: 99.3% Tin, 0.7% Copper. Rosin based flux, halide activated, normal activation level