509-0660

Multicomp Typ 511 solid fluxes for cored solder wires have been specially formulated to complement no clean wave and reflow soldering processes. They are also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning. Multicomp flux cored solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish.

• 包含多个松香助焊剂芯
• 浅色残留物, 无需清洁
• 良好的润湿能力, 可加快焊接速度
• 适用于所有通用无铅电子组装和返修应用
• 符合所有无铅法规要求
• Multicomp产品的评分为4.6 (满分5星)
• 12个月有限保修, 详细信息请参阅查看条款和条件
• 96％客户推荐

注释

Lead Free. Material Composition: 99.3% Tin, 0.7% Copper. Resin based flux, halide activated, normal activation level