509-0684

Multicomp Typ 505 solid fluxes for cored solder wires have been specially formulated to complement no clean wave and reflow soldering processes. They are also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning. Multicomp flux cored solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish. The good thermal stability of fluxe 505 means, they are also well suited to soldering applications requiring high melting temperature alloys.

• Mildly activated no-clean flux formulation
• Increased flux content (3% by weight) - low fuming and low spitting
• Minimal clear residues do not require cleaning
• Complies with all lead-free legislative requirements
• Suitable for general lead-free, no-clean assembly, or rework of PCBs assembled in a lead-free no-clean process
• Multicomp products are rated 4.6 out of 5 stars
• 12 month limited warranty *view Terms & Conditions for details
• 96% of customers would recommend to a friend

注释

Lead Free. Material Composition: 99.3% Tin, 0.7% Copper. Resin based flux, halide activated, low activation level