509-0726

Multicomp Typ 505 solid fluxes for cored solder wires have been specially formulated to complement no clean wave and reflow soldering processes. They are also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning. Multicomp flux cored solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish. The good thermal stability of fluxe 505 means, they are also well suited to soldering applications requiring high melting temperature alloys.

• 轻度活化免清洗助焊剂配方
• 助焊剂含量 (重量3％), 低烟雾和低吐出
• 透明残留物, 无需清洁
• 符合所有无铅法规要求
• 适用于普通无铅, 免清洗组装, 或无铅免清洗PCB返工工艺
• Multicomp产品的评分为4.6 (满分5星)
• 12个月有限保修, 详细信息请参阅查看条款和条件
• 96％客户推荐

注释

Lead Free. Material Composition: 99.3% Tin, 0.7% Copper. Resin based flux, halide activated, low activation level