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产品信息
产品概述
Great value and wide range of prototyping breadboards. Get prototyping your design with our range of solderless breadboards from Multicomp. Available in various sizes and configurations
- Pitch spacing is 2.54mm
- One terminal strip with 170 tie-points
- Rated voltage is 300V
- Rated current is 3A to 5A
- Insulation resistance is 500Mohm at 500VDC
- Withstanding voltage is 1000VAC/1min
- Wire size range from 29AWG to 20AWG
- Temperature range from -25°C to +80°C
- 7mm to 8mm strip length, dimension of the board is 45.5mm x 34.5mm (L x W)
- Multicomp products are rated 4.6 out of 5 stars
- 12 month limited warranty *view Terms & Conditions for details
- 96% of customers would recommend to a friend
技术规格
面包板类型
面包板端子条
分配条/总线数量
-
扎带点总数
170Tie Points
端子条数量
1端子条
技术文档 (1)
法律与环境
原产地:
进行最后一道重要生产流程所在的地区原产地:China
进行最后一道重要生产流程所在的地区
进行最后一道重要生产流程所在的地区原产地:China
进行最后一道重要生产流程所在的地区
税则号:85340019
US ECCN:EAR99
EU ECCN:NLR
RoHS 合规:是
RoHS
RoHS 邻苯二甲酸盐合规:是
RoHS
下载产品合规证书
产品合规证书
重量(千克):.022

