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ARRAYJ-30035-64P-PCB
光电倍增管, 8x8 3mm传感器阵列, 适用于On Semiconductor ARRAYJ-BOB3-64P分线板
- 制造商：
- ONSEMI ONSEMI
- 制造商产品编号:
- ARRAYJ-30035-64P-PCB
- 库存编号
- 2949098
- 产品范围
- J-Series SiPM Sensor
- 技术数据表:
- ARRAYJ-30035-64P-PCB 数据表
产品范围选择器 (J-Series SiPM Sensor)
查看全系列相关产品产品概述
ON Semiconductor's range of J-Series SiPM sensors have been used to create high fill-factor, scaleable arrays. The sensors are mounted onto PCB boards with minimal dead space, forming arrays with industry-leading fill factor of up to 90%. The back of each ArrayJ has either one or more multi-way connectors, or a BGA (ball grid array). These allow access to the fast output* and standard I/O from each pixel in the array, and a common I/O from the summed substrates of the pixels. The ArrayJ products with connectors can be used to interface with the user's own readout via a mating connector, or to a ON Semiconductor Breakout Board (BOB).
- Each SiPM sensor in the array has three electrical connections: fast output, standard output and common
- The substrates (cathodes) of all sensors are summed together to form the common I/O
- Each individual fast output and standard I/O (anode) are routed to its own output pin
- The ARRAYJ-60035-64P is comprised of 64 individual 6 mm J-Series sensors arranged in a 8 x 8 array
- The connections to each array are provided by two Samtec 80-way connectors, type QTE-040-03-F-D-A
- These connectors mate with the Samtec QSE-040-01-F-D-A board-to-board connector and the Samtec EQCD High Speed Cable Assemblies.
警告
Market demand for this product has caused an extension in leadtimes. Delivery dates may fluctuate. Product exempt from discounts.
产品信息
技术文档 (2)
可延期交货
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