THJP Series 导热材料:

THJP surface mount chips are designed to provide an electrically isolated thermal conductive pathway to a ground plane or heat sink while maintaining the electrical isolation of the device. The devices are constructed with aluminum nitride substrates in both SnPb and Pb-free wraparound termination styles.

• Electrically isolated thermal conductor
• High thermal conductivity AlN substrate (170 W/mK)
• Electrically isolated terminations (> 999 MΩ)
• Low capacitance
• Available with SnPb or lead (Pb)-free wrap terminations
• Applications: Power supplies and converters, RF amplifiers,Synthesizers, SMPS, Filters