KC-LINK, KONNEKT Series SMD MLCC堆叠式多层陶瓷电容:

KC-LINK™ with KONNEKT™ technology surface mount multilayer ceramic chip capacitors are designed for high efficiency and high density power applications. KONNEKT high density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution for high density packaging. By utilizing KEMET's robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers and resonators where high efficiency is a primary concern. KONNEKT technology enables a low loss, low inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. With an operating temperature range up to 150°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling.

• Extremely high-power density and ripple current capability
• Extremely low equivalent series resistance (ESR)
• Extremely low equivalent series inductance (ESL)
• Low-loss orientation option for higher current handling capability
• Capacitance offerings ranging from 14 - 880 nF
• DC voltage ratings from 500 - 2,000 V
• Operating temperature range of -55°C to +150°C
• No capacitance shift with voltage & piezoelectric noise
• High thermal stability
• Surface mountable using standard MLCC reflow profiles.