ADPA7005-EVALZ

ADPA7005-EVALZ is an evaluation board to evaluate the ADPA7005 18GHz to 44GHz, GaAs, pHEMT, 32dBm (>1W), MMIC power amplifier. The ADPA7005-EVALZ consists of a two-layer printed circuit board (PCB) fabricated from a 10 mil thick, Rogers 4350B, copper clad mounted to an aluminium heat sink. The heat sink assists in providing thermal relief to the device as well as mechanical support to the PCB. Mounting holes on the heat sink allow attachment to larger heat sinks for improved thermal management. The RFIN and RFOUT ports on the ADPA7005-EVALZ are populated by 2.9mm, female coaxial connectors. The respective RF traces have a 50 ohm characteristic impedance. The ADPA7005-EVALZ is populated with components suitable for use over the entire -40°C to +85°C operating temperature range of the device. To calibrate board trace losses, a through calibration path is provided between the J1 and the J2 connectors. J1 and J2 must be populated with RF connectors to use the through calibration path.

• 2-layer Rogers 4350 evaluation board with heat sink
• End launch 2.9mm RF connectors
• Through calibration path

注释

ADI products are only authorized (and sold) for use by the customer and are not to be resold or otherwise passed on to any third party