573100D00010G

The 573100D00010G is a 10 x 8 x 22.86mm surface mount Heat Sink made of copper with tin plated finish. This heat sink features horizontal mount orientation and is suitable for use with D-Pak TO-252 device. This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. The elevated "Wings" of the heat sink provide ample surface area to dissipate the heat into the surrounding environment.

应用

通信与网络, 消费电子产品, 工业, 电机驱动与控制