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数量 | 价钱 (含税) |
---|---|
1+ | CNY131.490 (CNY148.5837) |
5+ | CNY131.020 (CNY148.0526) |
10+ | CNY130.540 (CNY147.5102) |
50+ | CNY130.080 (CNY146.9904) |
100+ | CNY129.600 (CNY146.448) |
250+ | CNY129.120 (CNY145.9056) |
产品信息
产品概述
CYW20737S is a compact, highly integrated Bluetooth Low Energy (BLE) system-in-package (SiP) module. The CYW20737S SiP includes an embedded BLE antenna, 24 MHz clock, and 512 Kb EEPROM, so only a minimal set of external components is needed to create a standalone BLE device. The CYW20737S is designed to accelerate time to market. The Bluetooth stack and several application profiles are built into the module, allowing customers to focus on their core applications. To further reduce application development time, the CYW20737S includes integrated software support, with one-click installation of the complete environment and a one-click compile/build/link/load cycle. All this, coupled with an ultra small form factor and support for a wide voltage range, makes the CYW20737S well suited for virtually any Bluetooth Smart application.
- ARM Cortex-M3 microcontroller unit (MCU)
- Broadcom Serial Control (BSC), SPI and UART interfaces
- 6.5 mm × 6.5 mm × 1.2 mm Land Grid Array (LGA) 48-pin package
技术规格
蓝牙 4.1
3.6V
-Mbps
-94dBm
85°C
No SVHC (21-Jan-2025)
1.4V
-m
2级, 3级
-40°C
-
技术文档 (1)
法律与环境
进行最后一道重要生产流程所在的地区原产地:Taiwan
进行最后一道重要生产流程所在的地区
RoHS
RoHS
产品合规证书