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数量 | 价钱 (含税) |
---|---|
1+ | CNY15.950 (CNY18.0235) |
10+ | CNY13.010 (CNY14.7013) |
25+ | CNY11.980 (CNY13.5374) |
50+ | CNY11.250 (CNY12.7125) |
100+ | CNY10.370 (CNY11.7181) |
500+ | CNY10.170 (CNY11.4921) |
产品信息
产品概述
IM73D122V01XTMA1 is a IM73D122V01 series ultra-low noise digital XENSIVTM MEMS microphone is designed for applications which require a very high SNR (low self-noise) and a high sensitivity. The flat frequency response (20Hz low-frequency roll-off) and tight manufacturing tolerance improve performance of multi-microphone (array) applications. This microphone is based on Infineon’s new sealed dual membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The powerful mix of ultra-high SNR and high sensitivity empowers high quality audio capturing for voice user interface applications in laptops, tablets or conferencing devices. Potential applications includes laptops and tablets, conference systems, smart speakers, home automation and IoT devices, cameras.
- PG-LLGA-5-3 package, ambient temperature range from -40 to 85°C
- Ultra-low self-noise/ultra-high SNR 73dB(A), very high sensitivity (-26 dBFS)
- Sealed dual membrane (SDM) technology with IP57 ingress protection at microphone level
- High dynamic range and acoustic overload point (AOP) of 122 dBSPL
- Very tight part-to-part phase and sensitivity matching (± 1dB)
- Flat frequency response with a low LFRO (low frequency roll-off) of 20Hz
- Very low group delay (7µs @ 1kHz)
- Powerful far-field and low volume audio pick-up
- Robust ingress protection (IP57) at a microphone level
- Enablement of advanced audio features (audio zoom, beamforming)
技术规格
MEMS 麦克风
全向性
PDM
LLGA
1.62V
3.6V
-26dB
5引脚
IP57
XENSIV Series
MEMS
1.62V 至 3.6V
73dB
122dB
-40°C
85°C
-
PDM
-
No SVHC (21-Jan-2025)
技术文档 (1)
法律与环境
进行最后一道重要生产流程所在的地区原产地:China
进行最后一道重要生产流程所在的地区
RoHS
RoHS
产品合规证书