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330 件可于 5-6 个工作日内送达(英国 库存)
该库存量售罄后,将不再备货
数量 | 价钱 (含税) |
---|---|
1+ | CNY156.690 (CNY177.0597) |
10+ | CNY147.760 (CNY166.9688) |
25+ | CNY139.080 (CNY157.1604) |
50+ | CNY137.680 (CNY155.5784) |
包装规格:每个
最低: 1
多件: 1
CNY156.69 (CNY177.06 含税)
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产品信息
制造商MICRON
制造商产品编号MT53E256M32D2FW-046 AUT:B
库存编号4050881
技术数据表
DRAM类型Mobile LPDDR4
记忆配置256M x 32位
IC 外壳 / 封装TFBGA
芯片安装表面安装
产品范围-
产品概述
MT53E256M32D2FW-046 AUT:B is a 4Gb mobile low-power DDR4 SDRAM with low VDDQ. It is a high-speed CMOS, dynamic random-access memory. This memory is internally configured with x16 I/O, 8-banks. Each of the x16’s 536,870,912-bit banks are organized as 32,768 rows by 1024 columns by 16bits. It has directed per-bank refresh for concurrent bank operation and ease of command scheduling. This memory has on-chip temperature sensor to control self refresh rate. It has clock-stop capability.
- Operating voltage range is 1.10V (VDD2)/0.60V or 1.10V (VDDQ)
- 256Meg x 32 configuration, =LPDDR4, 2die addressing, B design
- Packaging style is 200-ball TFBGA 10 x 14.5 x 1.1mm (Ø0.40 SMD)
- Cycle time is 468ps at RL = 36/40, partial-array self refresh (PASR)
- Operating temperature range is –40°C to +125°C, automotive qualified
- Clock rate is 2133MHz, data rate per pin is 4266Mb/s
- Ultra-low-voltage core and I/O power supplies
- 16n prefetch DDR architecture, 8 internal banks per channel for concurrent operation
- Single-data-rate CMD/ADR entry, bidirectional/differential data strobe per byte lane
- Programmable READ and WRITE latencies (RL/WL), selectable output drive strength (DS)
技术规格
DRAM类型
Mobile LPDDR4
IC 外壳 / 封装
TFBGA
产品范围
-
记忆配置
256M x 32位
芯片安装
表面安装
技术文档 (1)
法律与环境
原产地:
进行最后一道重要生产流程所在的地区原产地:Taiwan
进行最后一道重要生产流程所在的地区
进行最后一道重要生产流程所在的地区原产地:Taiwan
进行最后一道重要生产流程所在的地区
税则号:85423239
US ECCN:EAR99
EU ECCN:NLR
RoHS 合规:是
RoHS
RoHS 邻苯二甲酸盐合规:是
RoHS
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产品合规证书
重量(千克):.004536