74LVC1G34GX4

Nexperia has developed the innovative 4-pin X2SON4 package (SOT1269-2), part of our X2SON MicroPak range, to provide the smallest footprint for logic buffers and inverters. This leadless package’s pad pitch remains ≥0.4mm, making step-down masks unnecessary. Ten types in AUP and LVC technologies are available, including several Schmitt-trigger and open-drain options.