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BGM210PA22JIA2
蓝牙模块, BLE 5.1, 2 Mbps, 1.71 V到3.8 V, -94.1 dBm, -40°C到125 °C
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产品信息
制造商SILICON LABS
制造商产品编号BGM210PA22JIA2
库存编号3605121RL
产品范围BGM210P Series
技术数据表
蓝牙版本蓝牙 LE 5.1
电源电压最小值1.71V
电源电压最大值3.8V
信号范围最大值-
数据率2Mbps
蓝牙级别3级
接收灵敏度-94.1dBm
工作温度最小值-40°C
工作温度最高值125°C
产品范围BGM210P Series
SVHC(高度关注物质)To Be Advised
产品概述
BGM210P wireless Gecko Bluetooth module based on the EFR32BG21 SoC, it enables Bluetooth® Low Energy and Bluetooth Mesh connectivity while delivering best-in-class RF range and performance, future-proof capability for feature and OTA firmware updates, enhanced security, low active current consumption, and a temperature rating suited for operating in demanding environmental conditions.
- Bluetooth 5.1 and Bluetooth mesh connectivity
- Built-in and RF pin
- 10dBm TX power
- Bluetooth RX sensitivity of -97.0dBm at 1Mbps
- 32-bit ARM Cortex-M33 core at 38.4MHz
- 1024/96KB of flash/RAM memory
- Enhanced security features
- Optimal set of MCU peripherals
- 20 GPIO pins
- Operating temperature range from -40⁰C to +125⁰C
警告
Market demand for this product has caused an extension in leadtimes. Delivery dates may fluctuate. Product exempt from discounts.
技术规格
蓝牙版本
蓝牙 LE 5.1
电源电压最大值
3.8V
数据率
2Mbps
接收灵敏度
-94.1dBm
工作温度最高值
125°C
SVHC(高度关注物质)
To Be Advised
电源电压最小值
1.71V
信号范围最大值
-
蓝牙级别
3级
工作温度最小值
-40°C
产品范围
BGM210P Series
法律与环境
原产地：
进行最后一道重要生产流程所在的地区原产地：China
进行最后一道重要生产流程所在的地区
进行最后一道重要生产流程所在的地区原产地：China
进行最后一道重要生产流程所在的地区
税则号：84733020
US ECCN:5A992.c
EU ECCN:NLR
RoHS 合规：是
RoHS
RoHS 邻苯二甲酸盐合规:是
RoHS
SVHC:To Be Advised
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产品合规证书
重量（千克）：.01